| PART |
Description |
Maker |
| SI2400 SI2400-BS SI2400-KS SI3015-BS SI3015-KS |
V.22BIS ISOMODEM⑩ WITH INTEGRATED GLOBAL DAA
V.22BIS ISOMODEM WITH INTEGRATED GLOBAL DAA
|
ETC[ETC]
Silicon Laboratories
|
| SI2433 SI2414 SI2456 |
V.90, V.34, V.32BIS ISOMODEM WITH INTEGRATED GLOBAL DAA
|
Silicon Laboratories
|
| CPC5622 CPC5622ATR CPC5622A |
LITELINK??III Phone Line Interface IC (DAA)
LITELINK㈢ III Phone Line Interface IC (DAA)
|
CLARE[Clare, Inc.]
|
| CPC5620A CPC5620ATR CPC56201 CPC5621 CPC5621A CPC5 |
LITELINK? III Phone Line Interface IC (DAA)
LITELINK垄莽 III Phone Line Interface IC (DAA)
|
Clare, Inc.
|
| XE014JS-ITR |
DAA for shared-line applications.
|
XECOM
|
| AD1803 AD1803JRU AD1804 AD1804JRU |
U.S./International Modem DAA Line Codec Chipset
|
AD[Analog Devices]
|
| LAN0061-51 |
SMART-DAA Transformer
|
LinkCom Manufacturing Co., Ltd.
|
| TTLDM-65 LPSLDM-65 LDM-ACT-70 SMLDM-TTL-25 MDLDM-T |
3.3V Dual Micropower High-Side/Low-Side MOSFET Driver; Package: PDIP; No of Pins: 8; Temperature Range: 0°C to 70°C
Quad High Side Micropower MOSFET Driver with Internal Charge Pump; Package: SO; No of Pins: 16; Temperature Range: 0°C to 70°C
Tapped Delay Line 抽头延迟
|
Intersil, Corp.
Analog Devices, Inc.
TE Connectivity, Ltd.
Microsemi, Corp.
Microchip Technology, Inc.
|
| XEV90 |
56 KBPS DAA in a PLCC Package
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| XE0002D |
Modular DAA with 2/4 Wire Convertor
|
List of Unclassifed Manufacturers
ETC
|
| XE0092 |
Surface-Mount DAA Modules
|
Xecom
|
